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Position: Wire Bonding and Interconnection Technical Engineer
Institution: European Organization for Nuclear Research
Location: Genève, Switzerland
Duties: Are you a Wire Bonding and Interconnection Technical Engineer with experience in ultrasonic Aluminium wedge wire bonding as well as an interest in micro-connectivity and packaging of electronics and complex particle detector systems? Then seize the opportunity and join the Detector Technology group operating at the heart of CERN Experimental Physics Department. Within our team, you will contribute to the development and construction of leading-edge technical solutions for the next generation of particle detectors. Take part!
Requirements: Bachelor's degree or equivalent relevant experience in the field of electronics/elecromechanics or a related field. Experience: Demonstrated experience in micro-connectivity (Al wedge wire bonding) and interconnection techniques in an industrial or a research environment; Experience in design and/or conception of mechanical parts, e.g. jigs for wire bonding and assembly, and PCB layout would be an asset
   
Text: Wire Bonding and Interconnection Technical Engineer (EP-DT-DD-2021-90-LD) Geneva, Switzerland Contract Company Description At CERN, the European Organization for Nuclear Research, physicists and engineers are probing the fundamental structure of the universe. Using the world's largest and most complex scientific instruments, they study the basic constituents of matter - fundamental particles that are made to collide together at close to the speed of light. The process gives physicists clues about how particles interact, and provides insights into the fundamental laws of nature. Find out more on http://home.cern. Job Description Introduction Are you a Wire Bonding and Interconnection Technical Engineer with experience in ultrasonic Aluminium wedge wire bonding as well as an interest in micro-connectivity and packaging of electronics and complex particle detector systems? Then seize the opportunity and join the Detector Technology group operating at the heart of CERN Experimental Physics Department. Within our team, you will contribute to the development and construction of leading-edge technical solutions for the next generation of particle detectors. Take part! You will join: The Experimental Physics (EP) Department which carries out basic research in the field of experimental particle physics in a stimulating scientific atmosphere, standing as an important reference for the European physics community. It also contributes to the education and training of young scientists. The Detector Technologies (DT) group which is in charge of the development, construction, operation and maintenance of many particle detectors and their technical infrastructure for the different experiments at CERN. The Detector Development (DD) section provides expertise in various fields of detector technologies. It also comprises the operation of several facilities for detector R&D, such as the Wire Bonding and Interconnect facility and the Quality and Reliability Assurance lab, dedicated laboratories for the characterization of semiconductor and gaseous detectors, and it operates the EP irradiation facilities. EP-DT Website: http://ep-dep-dt.web.cern.c Functions As Wire Bonding and Interconnection Technical Engineer in the Detector Development Section, you will be responsible for providing wire bonding for a diverse clientele from all experiments as well as different projects at CERN. Together with the Bondlab manager you will ensure timely completion of the requests and provide feed-back as well as advice to the clients. You will support new requests with your expert knowledge to achieve optimized connections and help to develop new concepts in the field of interconnections. Furthermore, you will be part of the daily operation of the lab and contribute to the maintenance and operation of equipment and infrastructure. The Bondlab provides a service that includes mounting of electronics and solid-state detectors on printed circuit boards and flexible printed circuit boards and their connection using ultra-sonic aluminium wedge wire bonding using state of the art automatic bonding machines. Work requests range from R&D projects to small and medium size productions with several hundred pieces. The Bondlab is located in a class 7 cleanroom and is equipped with automatic wire bonding machines, pull tester, several inspection microscopes, pick and place machines as well as other auxiliary equipment. The Bondlab also provides expert advice for new projects for all matters related to connectivity of chips and particle detectors and participates together with the neighbouring QARTlab in reliability tests. You will: Provide service offered by the Bondlab, including Aluminium wedge wire bonding of electronic chips and solid-state detectors, mounting of components and related activities, including pull testing, visual inspection and reliability testing; Interact with clients, execute the work requests in consultation with the Bondlab manager, provide feed-back and information for the clients, prepare documentation; Support projects in new developments with expert advice on conception of electronic chip connections and card design and participate in the study of new interconnection technologies, exchange information with outside Bonding experts and liaise with equipment suppliers; Work on the conception and design of mechanical support structures for wire bonding and related activities of the Bondlab; Take care of the optimum functioning of the equipment, ensure daily operation of the Bondlab, contribute to the maintenance, order lab supplies and equipment and help maintaining the inventory. Qualifications Bachelor's degree or equivalent relevant experience in the field of electronics / elecromechanics or a related field. Experience: Demonstrated experience in micro-connectivity (Al wedge wire bonding) and interconnection techniques in an industrial or a research environment. Experience in design and/or conception of mechanical parts, e.g. jigs for wire bonding and assembly, and PCB layout would be an asset. Technical competencies: Operation and maintenance of electromechanical equipment and systems: , e.g. ultrasonic wedge wire bonding machines, pick and place machines, pull tester. Knowledge of joining techniques, ie gluing and aluminium wedge wire bonding. Assembly and packaging of electronic components. Knowledge and application of quality and reliability assurance techniques in electronics. Behavioural competencies: Achieving results: having a structured and organised approach towards work; being able to set priorities and plan tasks with results in mind. Solving problems: producing workable and timely solutions that meet requirements. Demonstrating flexibility: adapting quickly and resourcefully to shifting priorities and requirements. Working in teams: working well in groups and readily fitting into a team; participating fully and taking an active role in team activities. Learning and sharing knowledge: keeping up-to-date with developments in own field of expertise and readily absorbing new information. Language skills: Spoken and written English or French: ability to draw up technical texts in one of the two languages; good knowledge of both languages would be an asset Additional Information Eligibility and closing date: Diversity has been an integral part of CERN's mission since its foundation and is an established value of the Organization. Employing a diverse workforce is central to our success. We welcome applications from all Member States and Associate Member States . This vacancy will be filled as soon as possible, and applications should normally reach us no later than 13.08.2021 at 12:00 pm CET (midday). Employment Conditions Contract type: Limited duration contract (5 years). Subject to certain conditions, holders of limited-duration contracts may apply for an indefinite position. These functions require: Work in Radiation Areas. A valid driving licence is required. Work during nights, Sundays and official holidays, when required by the needs of the Organization. Stand-by duty, when required by the needs of the Organization. Job grade: 4-5 Job reference: EP-DT-DD-2021-90-LD Benchmark Job Title: Electromechanical Technical Engineer Please make sure you have all the documents needed to hand as you start your application, as once it is submitted, you will not be able to upload any documents or edit your application further I'm interested Privacy Policy I'm interested Refer a friend share this job Powered by (Data Processor) Privacy Policy and Terms of Use Share to WeChat × Copy the link and open WeChat to share. Copy to clipboard Open WeChat Share to WeChat × Use Scan QR Code in WeChat and click ··· to share.
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