Are you a Wire Bonding and Interconnection Technical Engineer with experience in ultrasonic Aluminium wedge wire bonding as well as an interest in micro-connectivity and packaging of electronics and complex particle detector systems? Then seize the opportunity and join the Detector Technology group operating at the heart of CERN Experimental Physics Department. Within our team, you will contribute to the development and construction of leading-edge technical solutions for the next generation of particle detectors. Take part!
Bachelor's degree or equivalent relevant experience in the field of electronics/elecromechanics or a related field. Experience: Demonstrated experience in micro-connectivity (Al wedge wire bonding) and interconnection techniques in an industrial or a research environment; Experience in design and/or conception of mechanical parts, e.g. jigs for wire bonding and assembly, and PCB layout would be an asset
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